Winding capacitor package structure and method of manufacturing the same

ABSTRACT

A winding capacitor package structure and a method of manufactured the same are provided. The winding capacitor package structure includes a winding assembly, a package assembly, a conductive assembly, and a bottom carrier frame. The winding assembly includes a winding positive foil and a winding negative foil. The winding assembly is enclosed by the package assembly. The package assembly includes a casing structure and a filling body received inside the casing structure. The casing structure includes a main casing for enclosing the filling body and a retaining body inwardly bent from a bottom side of the main casing. The filling body includes a plurality of layered structures, and each of the layered structure is connected between the winding assembly and the casing structure. Therefore, the filling body including the layered structures can be retained and limited inside the casing structure through the retaining body.

CROSS-REFERENCE TO RELATED PATENT APPLICATION

This application claims the benefit of priority to Taiwan PatentApplication No. 109119390, filed on Jun. 10, 2020. The entire content ofthe above identified application is incorporated herein by reference.

Some references, which may include patents, patent applications andvarious publications, may be cited and discussed in the description ofthis disclosure. The citation and/or discussion of such references isprovided merely to clarify the description of the present disclosure andis not an admission that any such reference is “prior art” to thedisclosure described herein. All references cited and discussed in thisspecification are incorporated herein by reference in their entiretiesand to the same extent as if each reference was individuallyincorporated by reference.

FIELD OF THE DISCLOSURE

The present disclosure relates to a capacitor package structure and amethod of manufacturing the same, and more particularly to a windingcapacitor package structure and a method of manufacturing the same.

BACKGROUND OF THE DISCLOSURE

Various applications of capacitors include being used in homeappliances, computer motherboards and peripherals, power supplies,communication products and automobiles. Capacitors such as solidelectrolytic capacitors are mainly used to provide functions such asfiltering, bypassing, rectifying, coupling, blocking and transforming.However, there is still room for improvement in the related art of thewinding capacitor.

SUMMARY OF THE DISCLOSURE

In response to the above-referenced technical inadequacies, the presentdisclosure provides a winding capacitor package structure and a methodof manufacturing the same.

In one aspect, the present disclosure provides a winding capacitorpackage structure, including a winding assembly, a package assembly, aconductive assembly, and a bottom carrier frame. The winding assemblyincludes a winding positive foil, a winding negative foil and twowinding insulating separators. The package assembly is used forcompletely enclosing the winding assembly. The package assembly includesa casing structure and a filling body, the casing structure includes anaccommodating space for receiving the winding assembly, and the fillingbody is received inside the accommodating space for completelyenveloping the winding assembly. The conductive assembly includes afirst conductive pin electrically contacting the winding positive foiland a second conductive pin electrically contacting the winding negativefoil. The bottom carrier frame is disposed on a bottom portion of thecasing structure so as to protect the filling body and match with thecasing structure. One of the two winding insulating separators isdisposed between the winding positive foil and the winding negativefoil, and one of the winding positive foil and the winding negative foilis disposed between the two winding insulating separators. The firstconductive pin includes a first embedded portion enclosed inside thepackage assembly and a first exposed portion exposed outside the packageassembly, and the second conductive pin includes a second embeddedportion enclosed inside the package assembly and a second exposedportion exposed outside the package assembly. The filling body includesa plurality of layered structures stacked on top of one another insequence, each of the layered structures is connected between thewinding assembly and the casing structure, and the layered structureshave the same or different filling materials. The casing structureincludes a main casing for enclosing the filling body and a retainingbody inwardly bent from a bottom side of the main casing, and thefilling body is retained and limited inside the casing structure by theretaining body.

In another aspect, the present disclosure provides a winding capacitorpackage structure, including a winding assembly, a package assembly, aconductive assembly, and a bottom carrier frame. The winding assemblyincludes a winding positive foil and a winding negative foil. Thepackage assembly is used for completely enclosing the winding assembly,and the package assembly includes a casing structure and a filling bodyreceived inside the casing structure. The conductive assembly includes afirst conductive pin electrically contacting the winding positive foiland a second conductive pin electrically contacting the winding negativefoil. The bottom carrier frame is disposed on a bottom portion of thecasing structure so as to protect the filling body and match with thecasing structure. The filling body includes a plurality of layeredstructures, and each of the layered structures is connected between thewinding assembly and the casing structure. The casing structure includesa main casing for enclosing the filling body and a retaining bodyinwardly bent from a bottom side of the main casing, and the fillingbody is retained and limited inside the casing structure by theretaining body.

In yet another aspect, the present disclosure provides a method ofmanufacturing a winding capacitor package structure, including: forminga base layer on an inner bottom surface of a casing structure; placing awinding assembly and a part of a conductive assembly inside anaccommodating space of the casing structure, wherein the windingassembly is disposed on the base layer; sequentially forming a pluralityof filling layers between the winding assembly and the casing structure;and then placing a bottom carrier frame on a bottom portion of thecasing structure so as to match with the casing structure. The casingstructure includes a main casing for enclosing the base layer and thefilling layer and a retaining body inwardly bent from a bottom side ofthe main casing, and the base layer and the filling layer are retainedand limited inside the casing structure by the retaining body.

Therefore, by virtue of “the filling body including a plurality oflayered structures, and each of the layered structure being connectedbetween the winding assembly and the casing structure” and “the casingstructure including a main casing for enclosing the filling body and aretaining body inwardly bent from a bottom side of the main casing”, thefilling body including the layered structures can be retained andlimited inside the casing structure by the retaining body.

Furthermore, by virtue of “sequentially forming a plurality of fillinglayers between the winding assembly and the casing structure” and “thecasing structure including a main casing for enclosing the filling layerand a retaining body inwardly bent from a bottom side of the maincasing”, the filling body including the layered structures can beretained and limited inside the casing structure by the retaining body.

These and other aspects of the present disclosure will become apparentfrom the following description of the embodiment taken in conjunctionwith the following drawings and their captions, although variations andmodifications therein may be affected without departing from the spiritand scope of the novel concepts of the disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure will become more completely understood from thefollowing detailed description and accompanying drawings.

FIG. 1 is a flowchart of a method of manufacturing a winding capacitorpackage structure according to a first embodiment of the presentdisclosure.

FIG. 2 is a perspective schematic view of a winding assembly of thewinding capacitor package structure according to the present disclosure.

FIG. 3 is a schematic view of step S100 (forming a base layer on aninner bottom surface of the casing structure) of the method ofmanufacturing the winding capacitor package structure according to thefirst embodiment of the present disclosure.

FIG. 4 is a schematic view of step S102 (placing the winding assemblyand a part of the conductive assembly in the accommodating space of thecasing structure) and step S104 (forming a filling layer between thewinding assembly and the casing structure) of the method ofmanufacturing the winding capacitor package structure according to thefirst embodiment of the present disclosure.

FIG. 5 is a schematic view step S104 (forming another filling layerbetween the winding assembly and the casing structure) of the method ofmanufacturing the winding capacitor package structure according to thefirst embodiment of the present disclosure.

FIG. 6 is a schematic view of step S104 (forming yet another fillinglayer between the winding assembly and the casing structure) of themethod of manufacturing the winding capacitor package structureaccording to the first embodiment of the present disclosure.

FIG. 7 is a schematic view of step S106 of the method of manufacturingthe winding capacitor package structure according to the firstembodiment of the present disclosure, and FIG. 7 is also a schematicview of a winding capacitor package structure according to the firstembodiment of the present disclosure.

FIG. 8 is a schematic view of a winding capacitor package structureaccording to a second embodiment of the present disclosure.

FIG. 9 is a schematic view of a winding capacitor package structureaccording to a third embodiment of the present disclosure.

FIG. 10 is a flowchart of a method of manufacturing a winding capacitorpackage structure according to a forth embodiment of the presentdisclosure.

FIG. 11 is a schematic view of step S400 (forming a base layer on aninner bottom surface of the casing structure) of the method ofmanufacturing the winding capacitor package structure according to theforth embodiment of the present disclosure.

FIG. 12 is a schematic view of step S402 (placing the winding assemblyand a part of the conductive assembly in the accommodating space of thecasing structure) and step S404 (forming a filling layer between thewinding assembly and the casing structure) of the method ofmanufacturing the winding capacitor package structure according to theforth embodiment of the present disclosure.

FIG. 13 is a schematic view of step S404 (forming another filling layerbetween the winding assembly and the casing structure) of the method ofmanufacturing the winding capacitor package structure according to theforth embodiment of the present disclosure.

FIG. 14 is a schematic view of step S404 (forming yet another fillinglayer between the winding assembly and the casing structure) of themethod of manufacturing the winding capacitor package structureaccording to the forth embodiment of the present disclosure.

FIG. 15 is a schematic view of step S406 of the method of manufacturingthe winding capacitor package structure according to the forthembodiment of the present disclosure, and FIG. 15 is also a schematicview of a winding capacitor package structure according to the forthembodiment of the present disclosure.

FIG. 16 is a schematic view of a winding capacitor package structureaccording to a fifth embodiment of the present disclosure.

FIG. 17 is a schematic view of a winding capacitor package structureaccording to a sixth embodiment of the present disclosure.

DETAILED DESCRIPTION OF THE EXEMPLARY EMBODIMENTS

The present disclosure is more particularly described in the followingexamples that are intended as illustrative only since numerousmodifications and variations therein will be apparent to those skilledin the art. Like numbers in the drawings indicate like componentsthroughout the views. As used in the description herein and throughoutthe claims that follow, unless the context clearly dictates otherwise,the meaning of “a”, “an”, and “the” includes plural reference, and themeaning of “in” includes “in” and “on”. Titles or subtitles can be usedherein for the convenience of a reader, which shall have no influence onthe scope of the present disclosure.

The terms used herein generally have their ordinary meanings in the art.In the case of conflict, the present document, including any definitionsgiven herein, will prevail. The same thing can be expressed in more thanone way. Alternative language and synonyms can be used for any term(s)discussed herein, and no special significance is to be placed uponwhether a term is elaborated or discussed herein. A recital of one ormore synonyms does not exclude the use of other synonyms. The use ofexamples anywhere in this specification including examples of any termsis illustrative only, and in no way limits the scope and meaning of thepresent disclosure or of any exemplified term. Likewise, the presentdisclosure is not limited to various embodiments given herein. Numberingterms such as “first”, “second” or “third” can be used to describevarious components, signals or the like, which are for distinguishingone component/signal from another one only, and are not intended to, norshould be construed to impose any substantive limitations on thecomponents, signals or the like.

First Embodiment

Referring to FIG. 1 to FIG. 7, a first embodiment of the presentdisclosure provides a method of manufacturing a winding capacitorpackage structure, including: firstly, referring to FIG. 1 and FIG. 3,forming a base layer 221 (such as a base resin layer) on an inner bottomsurface 2101 of a casing structure 21, the casing structure 21 includinga main casing 211 and a retaining body 212 inwardly bent from a bottomside of the main casing 211 (step S100); next, referring to FIG. 1 toFIG. 3, placing a winding assembly 1 and a part of a conductive assembly3 inside an accommodating space 2102 of the casing structure 21, thewinding assembly 1 being disposed on the base layer 221 (step S102);afterwards, referring to FIG. 1 and FIG. 4 to FIG. 6, sequentiallyforming a plurality of filling layers 222 (such as filling resin layers)between the winding assembly 1 and the casing structure 21, the fillinglayers 222 being retained and limited inside the casing structure 21 bythe retaining body 212 (step S104); and then referring to FIG. 1 andFIG. 7, placing a bottom carrier frame 4 on a bottom portion of thecasing structure 21 so as to match with the casing structure 21 (stepS106).

For example, referring to FIG. 3, the step of forming the base layer 221on the inner bottom surface 2101 of the casing structure 21 furtherincludes: firstly, filling an initial substrate material 221 a on theinner bottom surface 2101 of the casing structure 21; next, evacuatingair from the accommodating space 2102 of the casing structure 21 to forma vacuum accommodating space; and then curing the initial substratematerial 221 a so as to form the base layer 221. Moreover, referring toFIG. 4 to FIG. 6, the step of forming each of the filling layers 222between the winding assembly 1 and the casing structure 21 furtherincludes: firstly, filling an initial filling material 222 a between thewinding assembly 1 and the casing structure 21; and then evacuating airfrom the accommodating space 2102 of the casing structure 21 to form avacuum accommodating space; and then curing the initial filling material222 a so as to form the filling layer 222. However, the aforementioneddescription is merely an example and is not meant to limit the scope ofthe present disclosure. For example, the initial substrate material 221a and the initial filling material 222 a can also be cured or hardened(such as thermal drying or natural drying) so as to respectively formthe base layer 221 and the filling layer 222, so that the step ofevacuating air from the accommodating space 2102 of the casing structure21 can be omitted in the present disclosure.

Referring to FIG. 2 and FIG. 7, the first embodiment of the presentdisclosure provides a winding capacitor package structure Z, including awinding assembly 1, a package assembly 2, a conductive assembly 3 and abottom carrier frame 4.

Firstly, as shown in FIG. 2, the winding assembly 1 includes a windingpositive foil 11, a winding negative foil 12 and two winding insulatingseparators 13. More particularly, one of the two winding insulatingseparators 13 is disposed between the winding positive foil 11 and thewinding negative foil 12, and one of the winding positive foil 11 andthe winding negative foil 12 is disposed between the two windinginsulating separators 13. For example, as shown in FIG. 2, the windingpositive foil 11 is disposed between the two winding insulatingseparators 13. In addition, the winding insulating separator 13 may bean insulating paper or insulating foil containing a dipping materialsuch as conductive polymer. However, the aforementioned description ismerely an example and is not meant to limit the scope of the presentdisclosure.

Moreover, as shown in FIG. 7, the winding assembly 1 is completelyenclosed by the package assembly 2, and the package assembly 2 includesa casing structure 21 (such as an Al casing or other metal casing) and afilling body 22 (such as a filling resin body). In addition, the casingstructure 21 has an accommodating space 2102 (or a receiving space) forreceiving the winding assembly 1, and the filling body 22 is filledinside the accommodating space 2102 for enclosing the winding assembly 1(that is to say, the accommodating space 2102 can be filled with thefilling body 22, so that the winding assembly 1 can be surrounded by thefilling body 22). More particularly, the casing structure 21 includes amain casing 211 for enclosing the filling body 22 and a retaining body212 inwardly bent from a bottom side of the main casing 211, and thefilling body 22 can be retained and limited inside the casing structure21 by the retaining body. For example, the filling body 22 can be madeof any insulative material such as epoxy or silicon. However, theaforementioned description is merely an example and is not meant tolimit the scope of the present disclosure.

For example, as shown in FIG. 7, the filling body 22 includes a baselayer 221 that is disposed between an inner bottom surface 2101 of thecasing structure 21 and a top surface of the winding assembly 1, and aplurality of the filling layers 222 that are stacked on top of oneanother in sequence and disposed on the base layer 221. In addition, thebottom carrier frame 4 is tightly connected to an outermost one of thefilling layers 222, and the other filling layers 222 are spaced apartfrom the bottom carrier frame 4. Moreover, a viscosity coefficient ofthe base layer 221 is different from or equals to a viscositycoefficient of the filling layers 222, and a heat conductivitycoefficient of the base layer 221 is different from or equals to a heatconductivity coefficient of the filling layers 222. That is to say, thefilling body 22 includes a plurality of layered structures (including abase layer 221 and a plurality of filling layers 222) stacked on top ofone another in sequence, and each of the layered structures is connectedbetween the winding assembly 1 and the casing structure 21, and aplurality of the layered structures have the same or different fillingmaterials. However, the aforementioned description is merely an exampleand is not meant to limit the scope of the present disclosure.

Furthermore, referring to FIG. 2 and FIG. 7, the conductive assembly 3includes a first conductive pin 31 electrically contacting the windingpositive foil 11 and a second conductive pin 32 electrically contactingthe winding negative foil 12. For example, the first conductive pin 31includes a first embedded portion 311 enclosed inside the packageassembly 2 and a first exposed portion 312 exposed outside the packageassembly 2, and the second conductive pin 32 includes a second embeddedportion 321 enclosed inside the package assembly 2 and a second exposedportion 322 exposed outside the package assembly 2. However, theaforementioned description is merely an example and is not meant tolimit the scope of the present disclosure.

In addition, referring to FIG. 2 and FIG. 7, the bottom carrier frame 4is disposed on a bottom portion of the casing structure 21 so as toprotect the filling body 22 and match with the casing structure 21. Forexample, the bottom carrier frame 4 includes a covering portion 41 forcontacting and covering the filling body 22, and a matching portion 42for matching with the casing structure 21, and the matching portion 42is downwardly extended from an outer periphery of the covering portion41 so as to surround and contact the casing structure 21. Moreover, thebottom carrier frame 4 has at least two through holes 4000, and a part(an embedded part) of the first exposed portion 312 of the firstconductive pin 31 and a part (an embedded part) of the second exposedportion 322 of the second conductive pin 32 are respectively disposedinside the at least two through holes 4000, and another part (an exposedpart) of the first exposed portion 312 of the first conductive pin 31and another part (an exposed part) of the second exposed portion 322 ofthe second conductive pin 32 are respectively disposed outside the atleast two through holes 4000. It should be noted that another part (theexposed part) of the first exposed portion 312 of the first conductivepin 31 and another part (the exposed part) of the second exposed portion322 of the second conductive pin 32 can be respectively bent toward twoopposite directions and both can be bent at about a 90 degree angle andextend along the covering portion 41. However, the aforementioneddescription is merely an example and is not meant to limit the scope ofthe present disclosure.

Second Embodiment

Referring to FIG. 8, a second embodiment of the present disclosureprovides a winding capacitor package structure Z, including a windingassembly 1, a package assembly 2, a conductive assembly 3 and a bottomcarrier frame 4. Comparing FIG. 8 with FIG. 7, the difference betweenthe second embodiment and the first embodiment is as follows: in thesecond embodiment, the winding assembly 1 can be completely enclosed byan enclosed moisture barrier layer LE, and a first junction that isbetween the winding assembly 1 and the first conductive pin 31 and asecond junction that is between the winding assembly 1 and the secondconductive pin 32 are covered by the enclosed moisture barrier layer LEso as to prevent external moisture from entering the winding capacitorpackage structure Z through the first junction or the second junction,so that the enclosed moisture barrier layer LE can be used to preventthe winding assembly 1 from rusting under the effect of externalmoisture.

Third Embodiment

Referring to FIG. 9, a third embodiment of the present disclosureprovides a winding capacitor package structure Z, including a windingassembly 1, a package assembly 2, a conductive assembly 3, and a bottomcarrier frame 4. Comparing FIG. 9 with FIG. 7, the difference betweenthe third embodiment and the first embodiment is as follows: in thethird embodiment, a part of the first conductive pin 31 is surrounded bya first moisture barrier layer L1, and a first junction between thewinding assembly 1 and the first conductive pin 31 is covered by thefirst moisture barrier layer L1 so as to prevent external moisture fromentering the winding capacitor package structure Z through the firstjunction, so that the first moisture barrier layer L1 can be used toprevent the winding assembly 1 from rusting under the effect of externalmoisture. In addition, a part of the second conductive pin 32 issurrounded by a second moisture barrier layer L2, and a second junctionbetween the winding assembly 1 and the second conductive pin 32 iscovered by the second moisture barrier layer L2 so as to preventexternal moisture from entering the winding capacitor package structureZ through the second junction, so that the second moisture barrier layerL2 can be used to prevent the winding assembly 1 from rusting under theeffect of external moisture.

Fourth Embodiment

Referring to FIG. 1 to FIG. 15, a fourth embodiment of the presentdisclosure provides a method of manufacturing a winding capacitorpackage structure Z, including: firstly, referring to FIG. 1 and FIG.11, forming a base layer 221 on an inner bottom surface 2101 of a casingstructure 21, the casing structure 21 including a rough inner surface2103 (step S400); next, referring to FIG. 10 and FIG. 11, placing awinding assembly 1 and a part of a conductive assembly 3 inside anaccommodating space 2102 of the casing structure 21, the windingassembly 1 being disposed on the base layer 221 (step S402); afterwards,referring to FIG. 10 and FIG. 12 to FIG. 14, sequentially forming aplurality of filling layers 222 between the winding assembly 1 and thecasing structure 21, the filling layers 222 being limited inside thecasing structure 21 through a friction provided by the rough innersurface 2103 of the casing structure 21 (step S404); and then referringto FIG. 10 and FIG. 15, placing a bottom carrier frame 4 on a bottomportion of the casing structure 21 so as to match with the casingstructure 21 (step S406).

For example, referring to FIG. 10 and FIG. 11, the step of forming thebase layer 221 on the inner bottom surface 2101 of the casing structure21 further includes: firstly, filling an initial substrate material 221a on the inner bottom surface 2101 of the casing structure 21; next,evacuating air from the accommodating space 2102 of the casing structure21 to form a vacuum accommodating space; and then curing the initialsubstrate material 221 a so as to form the base layer 221. Moreover,referring to FIG. 10 and FIG. 12 to FIG. 14, the step of forming each ofthe filling layers 222 between the winding assembly 1 and the casingstructure 21 further includes: firstly, filling an initial fillingmaterial 222 a between the winding assembly 1 and the casing structure21; next, evacuating air from the accommodating space 2102 of the casingstructure 21 to form a vacuum accommodating space; and then curing theinitial filling material 222 a so as to form the filling layer 222.However, the aforementioned description is merely an example and is notmeant to limit the scope of the present disclosure. For example, theinitial substrate material 221 a and the initial filling material 222 acan also be cured or hardened (such as thermal drying or natural drying)so as to respectively form the base layer 221 and the filling layer 222,so that the step of evacuating air from the accommodating space 2102 ofthe casing structure 21 can be omitted in the present disclosure.

Referring to FIG. 15, the fourth embodiment of the present disclosurefurther provides a winding capacitor package structure Z, including awinding assembly 1, a package assembly 2, a conductive assembly 3, and abottom carrier frame 4. The winding assembly 1, the conductive assembly3 and the bottom carrier frame 4 of the fourth embodiment are the sameas the winding assembly 1, the conductive assembly 3 and the bottomcarrier frame 4 of the first embodiment, respectively.

Moreover, as shown in FIG. 15, the winding assembly 1 can be completelyenclosed by the package assembly 2, and the package assembly 2 includesa casing structure 21 (such as an Al casing or other metal casing) and afilling body 22. In addition, the casing structure 21 has anaccommodating space 2102 (or a receiving space) for receiving thewinding assembly 1, and the filling body 22 is filled inside theaccommodating space 2102 for enclosing the winding assembly 1 (that isto say, the accommodating space 2102 can be filled with the filling body22, so that the winding assembly 1 can be surrounded by the filling body22). More particularly, the casing structure 21 includes a rough innersurface 2103, and the filling body 22 is limited inside the casingstructure 21 through a friction provided by the rough inner surface 2103of the casing structure 21. For example, the filling body 22 can be madeof any insulative material such as epoxy or silicon. However, theaforementioned description is merely an example and is not meant tolimit the scope of the present disclosure.

For example, referring to FIG. 15, the filling body 22 includes a baselayer 221 that is disposed between an inner bottom surface 2101 of thecasing structure 21 and a top surface of the winding assembly 1, and aplurality of the filling layers 222 that are stacked on top of oneanother in sequence and disposed on the base layer 221. In addition, thebottom carrier frame 4 is tightly connected to an outermost one of thefilling layers 222, and the other filling layers 222 are spaced apartfrom the bottom carrier frame 4. Moreover, a viscosity coefficient ofthe base layer 221 is different from or equals to a viscositycoefficient of the filling layers 222, and a heat conductivitycoefficient of the base layer 221 is different from or equals to a heatconductivity coefficient of the filling layers 222. That is to say, thefilling body 22 includes a plurality of layered structures (including abase layer 221 and a plurality of filling layers 222) stacked on top ofone another in sequence, and each of the layered structures is connectedbetween the winding assembly 1 and the casing structure 21, and aplurality of the layered structures have the same or different fillingmaterials. However, the aforementioned description is merely an exampleand is not meant to limit the scope of the present disclosure.

Fifth Embodiment

Referring to FIG. 16, a fifth embodiment of the present disclosureprovides a winding capacitor package structure Z, including a windingassembly 1, a package assembly 2, a conductive assembly 3 and a bottomcarrier frame 4. Comparing FIG. 16 with FIG. 15, the difference betweenthe fifth embodiment and the fourth embodiment is as follows: in thefifth embodiment, the winding assembly 1 can be completely enclosed byan enclosed moisture barrier layer LE, and a first junction that isbetween the winding assembly 1 and the first conductive pin 31 and asecond junction that is between the winding assembly 1 and the secondconductive pin 32 are covered by the enclosed moisture barrier layer LEso as to prevent external moisture from entering the winding capacitorpackage structure Z through the first junction or the second junction,so that the enclosed moisture barrier layer LE can be used to preventthe winding assembly 1 from rusting under the effect of externalmoisture.

Sixth Embodiment

Referring to FIG. 17, a sixth embodiment of the present disclosureprovides a winding capacitor package structure Z, including a windingassembly 1, a package assembly 2, a conductive assembly 3, and a bottomcarrier frame 4. Comparing FIG. 17 with FIG. 15, the difference betweenthe sixth embodiment and the fourth embodiment is as follows: in thesixth embodiment, a part of the first conductive pin 31 is surrounded bya first moisture barrier layer L1, and a first junction between thewinding assembly 1 and the first conductive pin 31 is covered by thefirst moisture barrier layer L1 so as to prevent external moisture fromentering the winding capacitor package structure Z through the firstjunction, so that the first moisture barrier layer L1 can be used toprevent the winding assembly 1 from rusting under the effect of externalmoisture. In addition, a part of the second conductive pin 32 issurrounded by a second moisture barrier layer L2, and a second junctionbetween the winding assembly 1 and the second conductive pin 32 iscovered by the second moisture barrier layer L2 so as to preventexternal moisture from entering the winding capacitor package structureZ through the second junction, so that the second moisture barrier layerL2 can be used to prevent the winding assembly 1 from rusting under theeffect of external moisture.

It should be noted that the retaining body 212 of the first embodimentand the rough inner surface 2103 of the fourth embodiment can bedisposed on the same casing structure 21, so that the filling body 22can not only be retained and limited inside the casing structure 21 bythe retaining body 212, but can also be limited inside the casingstructure 22 through a friction provided by the rough inner surface 2103of the casing structure 21, so as to enhance the effect for limiting thefilling body 22 inside the casing structure 21.

In conclusion, by virtue of “the filling body 22 including a pluralityof layered structures, and each of the layered structures beingconnected between the winding assembly 1 and the casing structure 21”and “the casing structure 21 including a main casing 211 for enclosingthe filling body 22 and a retaining body 212 inwardly bent from a bottomside of the main casing 211”, the filling body 22 including the layeredstructures can be retained and limited inside the casing structure 21 bythe retaining body 212.

Furthermore, by virtue of “sequentially forming a plurality of fillinglayers 222 between the winding assembly 1 and the casing structure 21”and “the casing structure 21 including a main casing 211 for enclosingthe filling layer 222 and a retaining body 212 inwardly bent from abottom side of the main casing 211”, the filling body 22 including thelayered structures can be retained and limited inside the casingstructure 21 by the retaining body 212. The foregoing description of theexemplary embodiments of the disclosure has been presented only for thepurposes of illustration and description and is not intended to beexhaustive or to limit the disclosure to the precise forms disclosed.Many modifications and variations are possible in light of the aboveteaching.

The embodiments were chosen and described in order to explain theprinciples of the disclosure and their practical application so as toenable others skilled in the art to utilize the disclosure and variousembodiments and with various modifications as are suited to theparticular use contemplated. Alternative embodiments will becomeapparent to those skilled in the art to which the present disclosurepertains without departing from its spirit and scope.

What is claimed is:
 1. A winding capacitor package structure,comprising: a winding assembly including a winding positive foil, awinding negative foil and two winding insulating separators; a packageassembly for completely enclosing the winding assembly, wherein thepackage assembly includes a casing structure and a filling body, thecasing structure includes an accommodating space for receiving thewinding assembly, and the filling body is received inside theaccommodating space for completely enveloping the winding assembly; aconductive assembly including a first conductive pin electricallycontacting the winding positive foil and a second conductive pinelectrically contacting the winding negative foil; and a bottom carrierframe disposed on a bottom portion of the casing structure so as toprotect the filling body and match with the casing structure; whereinone of the two winding insulating separators is disposed between thewinding positive foil and the winding negative foil, and one of thewinding positive foil and the winding negative foil is disposed betweenthe two winding insulating separators; wherein the first conductive pinincludes a first embedded portion enclosed inside the package assemblyand a first exposed portion exposed outside the package assembly, andthe second conductive pin includes a second embedded portion enclosedinside the package assembly and a second exposed portion exposed outsidethe package assembly; wherein the filling body includes a plurality oflayered structures stacked on top of one another in sequence, each ofthe layered structures is connected between the winding assembly and thecasing structure, and the layered structures have the same or differentfilling materials; wherein the casing structure includes a main casingfor enclosing the filling body and a retaining body inwardly bent from abottom side of the main casing, and the filling body is retained andlimited inside the casing structure by the retaining body.
 2. Thewinding capacitor package structure according to claim 1, wherein thefilling body includes a base layer disposed between an inner bottomsurface of the casing structure and a top surface of the windingassembly, and a plurality of filling layers stacked on top of oneanother in sequence and disposed on the base layer, the bottom carrierframe is tightly connected to an outermost one of the filling layers,and the other filling layers are spaced apart from the bottom carrierframe; wherein a viscosity coefficient of the base layer is differentfrom or equals to a viscosity coefficient of the filling layer, and aheat conductivity coefficient of the base layer is different from orequals to a heat conductivity coefficient of the filling layer; whereinthe winding assembly is completely enclosed by an enclosed moisturebarrier layer, and a first junction between the winding assembly and thefirst conductive pin and a second junction between the winding assemblyand the second conductive pin are covered by the enclosed moisturebarrier layer; wherein the casing structure includes a rough innersurface, and the filling body is limited inside the casing structurethrough a friction provided by the rough inner surface of the casingstructure.
 3. The winding capacitor package structure according to claim1, wherein the filling body includes a base layer disposed between aninner bottom surface of the casing structure and a top surface of thewinding assembly, and a plurality of filling layers stacked on top ofone another in sequence and disposed on the base layer, the bottomcarrier frame is tightly connected to an outermost one of the fillinglayers, and the other filling layers are spaced apart from the bottomcarrier frame; wherein a viscosity coefficient of the base layer isdifferent from or equals to a viscosity coefficient of the fillinglayer, and a heat conductivity coefficient of the base layer isdifferent from or equals to a heat conductivity coefficient of thefilling layer; wherein a part of the first conductive pin is surroundedby a first moisture barrier layer, and a first junction between thewinding assembly and the first conductive pin is covered by the firstmoisture barrier layer; wherein a part of the second conductive pin issurrounded by a second moisture barrier layer, and a second junctionbetween the winding assembly and the second conductive pin is covered bythe second moisture barrier layer; wherein the casing structure includesa rough inner surface, and the filling body is limited inside the casingstructure through a friction provided by the rough inner surface of thecasing structure.
 4. The winding capacitor package structure accordingto claim 1, wherein the bottom carrier frame includes a covering portionfor contacting and covering the filling body, and a matching portion formatching with the casing structure, and the matching portion isdownwardly extended from an outer periphery of the covering portion inorder to surround and contact the casing structure; wherein the bottomcarrier frame includes at least two through holes, a part of the firstexposed portion of the first conductive pin and a part of the secondexposed portion of the second conductive pin are respectively disposedinside the at least two through holes, and another part of the firstexposed portion of the first conductive pin and another part of thesecond exposed portion of the second conductive pin are respectivelydisposed outside the at least two through holes.
 5. A winding capacitorpackage structure, comprising: a winding assembly including a windingpositive foil and a winding negative foil; a package assembly forcompletely enclosing the winding assembly, wherein the package assemblyincludes a casing structure and a filling body received inside thecasing structure; a conductive assembly including a first conductive pinelectrically contacting the winding positive foil and a secondconductive pin electrically contacting the winding negative foil; and abottom carrier frame disposed on a bottom portion of the casingstructure so as to protect the filling body and match with the casingstructure; wherein the filling body includes a plurality of layeredstructures, and each of the layered structures is connected between thewinding assembly and the casing structure; wherein the casing structureincludes a main casing for enclosing the filling body and a retainingbody inwardly bent from a bottom side of the main casing, and thefilling body is retained and limited inside the casing structure by theretaining body.
 6. The winding capacitor package structure according toclaim 5, wherein the filling body includes a base layer disposed betweenan inner bottom surface of the casing structure and a top surface of thewinding assembly, and a plurality of filling layers stacked on top ofone another in sequence and disposed on the base layer, the bottomcarrier frame is tightly connected to an outermost one of the fillinglayers, and the other filling layers are spaced apart from the bottomcarrier frame; wherein a viscosity coefficient of the base layer isdifferent from or equals to a viscosity coefficient of the fillinglayer, and a heat conductivity coefficient of the base layer isdifferent from or equals to a heat conductivity coefficient of thefilling layer; wherein the winding assembly is completely enclosed by anenclosed moisture barrier layer, and a first junction between thewinding assembly and the first conductive pin and a second junctionbetween the winding assembly and the second conductive pin are coveredby the enclosed moisture barrier layer; wherein the casing structureincludes a rough inner surface, and the filling body is limited insidethe casing structure through a friction provided by the rough innersurface of the casing structure.
 7. The winding capacitor packagestructure according to claim 5, wherein the filling body includes a baselayer disposed between an inner bottom surface of the casing structureand a top surface of the winding assembly, and a plurality of fillinglayers stacked on top of one another in sequence and disposed on thebase layer, the bottom carrier frame is tightly connected to anoutermost one of the filling layers, and the other filling layers arespaced apart from the bottom carrier frame; wherein a viscositycoefficient of the base layer is different from or equals to a viscositycoefficient of the filling layer, and a heat conductivity coefficient ofthe base layer is different from or equals to a heat conductivitycoefficient of the filling layer; wherein a part of the first conductivepin is surrounded by a first moisture barrier layer, and a firstjunction between the winding assembly and the first conductive pin iscovered by the first moisture barrier layer; wherein a part of thesecond conductive pin is surrounded by a second moisture barrier layer,and a second junction between the winding assembly and the secondconductive pin is covered by the second moisture barrier layer; whereinthe casing structure includes a rough inner surface, and the fillingbody is limited inside the casing structure through a friction providedby the rough inner surface of the casing structure.
 8. A method ofmanufacturing a winding capacitor package structure, comprising: forminga base layer on an inner bottom surface of a casing structure; placing awinding assembly and a part of a conductive assembly inside anaccommodating space of the casing structure, wherein the windingassembly is disposed on the base layer; sequentially forming a pluralityof filling layers between the winding assembly and the casing structure;and placing a bottom carrier frame on a bottom portion of the casingstructure so as to match with the casing structure; wherein the casingstructure includes a main casing for enclosing the base layer and thefilling layer and a retaining body inwardly bent from a bottom side ofthe main casing, and the base layer and the filling layer are retainedand limited inside the casing structure by the retaining body.
 9. Themethod according to claim 8, wherein the step of forming the base layeron the inner bottom surface of the casing structure further comprises:filling an initial substrate material on the inner bottom surface of thecasing structure; evacuating air from the accommodating space of thecasing structure to form a vacuum accommodating space; and curing theinitial substrate material in order to form the base layer; wherein thecasing structure includes a rough inner surface, and the base layer islimited inside the casing structure through a friction provided by therough inner surface of the casing structure.
 10. The method according toclaim 8, wherein the step of forming each of the filling layers betweenthe winding assembly and the casing structure further comprises: fillingan initial filling material between the winding assembly and the casingstructure; evacuating air from the accommodating space of the casingstructure to form a vacuum accommodating space; and curing the initialfilling material in order to form the filling layer; wherein the casingstructure includes a rough inner surface, and the filling layer islimited inside the casing structure through a friction provided by therough inner surface of the casing structure.